CY8C20247S-24LKXI Development Tool Selection
Software
PSoC Designer?
At the core of the PSoC development software suite is
PSoC Designer, used to generate PSoC firmware applications.
PSoC Designer is a Microsoft
?
Windows-based, integrated
development environment for the Programmable System-onChip (PSoC) devices. The PSoC Designer IDE and application
runs on Windows XP and Windows Vista.
This system provides design database management by project,
in-system programming support, and built-in support for thirdparty assemblers and C compilers. PSoC Designer also
supports C language compilers developed specifically for the
devices in the PSoC family.
Tuesday, October 30, 2012
CY8C20247-24LKXIT Microcontroller Crack
CY8C20247-24LKXIT Microcontroller Crack, MCU code extraction, dsp crack, chip reverse, PCB cloning, PCB coping . PCB reverse engineering .
System resources provide additional capability, such as
configurable I
2
C slave, SPI master/slave communication
interface, three 16-bit programmable timers, various system
resets supported by the M8C low voltage detection and poweron reset. The merits of each system resource are listed here:
■ The I2C slave/SPI master-slave module provides 50/100/
400 kHz communication over two wires. SPI communication
over three or four wires runs at speeds of 46.9 kHz to 3 MHz
(lower for a slower system clock).
■ The I2C hardware address recognition feature reduces the
already low power consumption by eliminating the need for
CPU intervention until a packet addressed to the target device
is received.
■ The I2C enhanced slave interface appears as a 32-byte RAM
buffer to the external I2C master. Using a simple predefined
protocol, the master controls the read and write pointers into
the RAM. When this method is enabled, the slave does not stall
the bus when receiving data bytes in active mode. For usage
details, see the application note I2C Enhanced Slave Operation
- AN56007.
■ Low-voltage detection (LVD) interrupts can signal the
application of falling voltage levels, while the advanced poweron reset (POR) circuit eliminates the need for a system
supervisor.
■ An internal reference provides an absolute reference for
capacitive sensing.
■ A register-controlled bypass mode allows the user to disable
the LDO regulator.
System resources provide additional capability, such as
configurable I
2
C slave, SPI master/slave communication
interface, three 16-bit programmable timers, various system
resets supported by the M8C low voltage detection and poweron reset. The merits of each system resource are listed here:
■ The I2C slave/SPI master-slave module provides 50/100/
400 kHz communication over two wires. SPI communication
over three or four wires runs at speeds of 46.9 kHz to 3 MHz
(lower for a slower system clock).
■ The I2C hardware address recognition feature reduces the
already low power consumption by eliminating the need for
CPU intervention until a packet addressed to the target device
is received.
■ The I2C enhanced slave interface appears as a 32-byte RAM
buffer to the external I2C master. Using a simple predefined
protocol, the master controls the read and write pointers into
the RAM. When this method is enabled, the slave does not stall
the bus when receiving data bytes in active mode. For usage
details, see the application note I2C Enhanced Slave Operation
- AN56007.
■ Low-voltage detection (LVD) interrupts can signal the
application of falling voltage levels, while the advanced poweron reset (POR) circuit eliminates the need for a system
supervisor.
■ An internal reference provides an absolute reference for
capacitive sensing.
■ A register-controlled bypass mode allows the user to disable
the LDO regulator.
CY8C20247-24LKXI Microcontroller Crack
CY8C20247-24LKXI Microcontroller Crack, MCU code extraction, dsp crack, chip reverse, PCB cloning, PCB coping . PCB reverse engineering .
Features
■ QuietZone? Controller
? Patented Capacitive Sigma Delta PLUS (CSD PLUS?)
sensing algorithm for robust performance
? High Sensitivity (0.1 pF) and best-in-class SNR performance
to support:
? Ideal for proximity solutions
? Overlay thickness of 15 mm for glass and 5 mm plastic
? Superior noise immunity performance against conducted and
radiated noise and ultra low radiated emissions
? Reliable and robust touch performance in noisy environments
? Standardized user modules for overcoming noise
■ Low power CapSense
?
block with SmartSense? auto-tuning
? Supports a combination of up to 31 buttons or 6 sliders, proximity sensors
? Low average power consumption - 28 ?A for each sensor at
runtime (wake from sleep and scan sensors every 125 ms)
? SmartSense auto-tuning
? Sets and maintains optimal sensor performance during
runtime
? Eliminates system tuning during development and production
? Compensates for variations in manufacturing process
■ Driven shield available on five GPIO pins
? Max load of 100 pF at 3 MHz
? Frequency range: 375 kHz to 3 MHz
? Delivers best-in class water tolerant designs
? Robust proximity sensing in the presence of metal objects
■ Powerful Harvard-architecture processor
? M8C CPU with a maximum speed of 24 MHz
? Operating range: 1.71 V to 5.5 V
? Standby mode: 1.1 μA (typ)
? Deep sleep: 0.1 μA (typ)
? Temperature range: –40 °C to +85 °C
■ Flexible on-chip memory
? 8 KB flash, 1 KB SRAM
? 16 KB flash, 2 KB SRAM
? 32 KB flash, 2 KB SRAM
? 50,000 flash erase/write cycles
? In-system programming capability
■ Four clock sources
? Internal main oscillator (IMO): 6/12/24 MHz
? Internal low-speed oscillator (ILO) at 32 kHz for watchdog
and sleep timers
? RC crystal oscillator
? Clock input
■ Programmable pin configurations
? Up to 32 general-purpose I/Os (GPIOs)
? Dual mode GPIO
? High sink current of 25 mA for each GPIO. Total 120 mA
maximum sink current per chip
? 5 mA source current on port 0 and 1 and 1 mA on port 2,3
and 4
? Configurable internal pull-up, high-Z, and open drain modes
? Selectable, regulated digital I/O on port 1
? Configurable input threshold on port 1
■ Versatile analog mux
? Common internal analog bus
? Simultaneous connection of I/O
? High power supply rejection ratio (PSRR) comparator
? Low-dropout voltage regulator for all analog resources
■ Additional system resources
? I2C slave:
? Selectable to 50 kHz, 100 kHz, or 400 kHz
? Selectable clock stretch or forced Nack mode
? Implementation during sleep modes with less than 100 μA
? I2C wake from sleep with hardware address validation
? 12 MHz SPI master and slave
? Three 16-bit timers
? Watchdog and sleep timers
? Internal voltage reference
? Integrated supervisory circuit
? 10-bit incremental analog-to-digital converter (ADC)
? Two general-purpose high speed, low power analog comparators
■ Complete development tools
? Free development tool (PSoC Designer?)
■ Package options
? 16-pin SOIC (150 mil)
? 16-pin QFN – 3 × 3 × 0.6 mm
? 24-pin QFN – 4 × 4 × 0.6 mm
? 32-pin QFN – 5 × 5 × 0.6 mm
? 48-pin QFN – 6 × 6 × 0.6 mm
? 30-ball WLCSP
Features
■ QuietZone? Controller
? Patented Capacitive Sigma Delta PLUS (CSD PLUS?)
sensing algorithm for robust performance
? High Sensitivity (0.1 pF) and best-in-class SNR performance
to support:
? Ideal for proximity solutions
? Overlay thickness of 15 mm for glass and 5 mm plastic
? Superior noise immunity performance against conducted and
radiated noise and ultra low radiated emissions
? Reliable and robust touch performance in noisy environments
? Standardized user modules for overcoming noise
■ Low power CapSense
?
block with SmartSense? auto-tuning
? Supports a combination of up to 31 buttons or 6 sliders, proximity sensors
? Low average power consumption - 28 ?A for each sensor at
runtime (wake from sleep and scan sensors every 125 ms)
? SmartSense auto-tuning
? Sets and maintains optimal sensor performance during
runtime
? Eliminates system tuning during development and production
? Compensates for variations in manufacturing process
■ Driven shield available on five GPIO pins
? Max load of 100 pF at 3 MHz
? Frequency range: 375 kHz to 3 MHz
? Delivers best-in class water tolerant designs
? Robust proximity sensing in the presence of metal objects
■ Powerful Harvard-architecture processor
? M8C CPU with a maximum speed of 24 MHz
? Operating range: 1.71 V to 5.5 V
? Standby mode: 1.1 μA (typ)
? Deep sleep: 0.1 μA (typ)
? Temperature range: –40 °C to +85 °C
■ Flexible on-chip memory
? 8 KB flash, 1 KB SRAM
? 16 KB flash, 2 KB SRAM
? 32 KB flash, 2 KB SRAM
? 50,000 flash erase/write cycles
? In-system programming capability
■ Four clock sources
? Internal main oscillator (IMO): 6/12/24 MHz
? Internal low-speed oscillator (ILO) at 32 kHz for watchdog
and sleep timers
? RC crystal oscillator
? Clock input
■ Programmable pin configurations
? Up to 32 general-purpose I/Os (GPIOs)
? Dual mode GPIO
? High sink current of 25 mA for each GPIO. Total 120 mA
maximum sink current per chip
? 5 mA source current on port 0 and 1 and 1 mA on port 2,3
and 4
? Configurable internal pull-up, high-Z, and open drain modes
? Selectable, regulated digital I/O on port 1
? Configurable input threshold on port 1
■ Versatile analog mux
? Common internal analog bus
? Simultaneous connection of I/O
? High power supply rejection ratio (PSRR) comparator
? Low-dropout voltage regulator for all analog resources
■ Additional system resources
? I2C slave:
? Selectable to 50 kHz, 100 kHz, or 400 kHz
? Selectable clock stretch or forced Nack mode
? Implementation during sleep modes with less than 100 μA
? I2C wake from sleep with hardware address validation
? 12 MHz SPI master and slave
? Three 16-bit timers
? Watchdog and sleep timers
? Internal voltage reference
? Integrated supervisory circuit
? 10-bit incremental analog-to-digital converter (ADC)
? Two general-purpose high speed, low power analog comparators
■ Complete development tools
? Free development tool (PSoC Designer?)
■ Package options
? 16-pin SOIC (150 mil)
? 16-pin QFN – 3 × 3 × 0.6 mm
? 24-pin QFN – 4 × 4 × 0.6 mm
? 32-pin QFN – 5 × 5 × 0.6 mm
? 48-pin QFN – 6 × 6 × 0.6 mm
? 30-ball WLCSP
CY8C20324-12LQXI MCU Reverse
CY8C20324-12LQXI MCU Reverse,mcu crack, chip decryption, pcb coping, pcb reverse engineering.
Features
■ Low power, configurable CapSense
?
? Configurable capacitive sensing elements
? operating voltage
? Operating voltage: 2.4 V to 5.25 V
? Low operating current
? Active 1.5 mA (at 3.0 V, 12 MHz)
? Sleep 2.8 μA (at 3.3 V)
? Supports up to 25 capacitive buttons
? Supports one slider
? Up to 10 cm proximity sensing
? Supports up to 28 general-purpose I/O (GPIO) pins
? Drive LEDs and other outputs
? Configurable LED behavior (fading, strobing)
? LED color mixing (RBG LEDs)
? Pull-up, high Z, open-drain, and CMOS drive modes on all
GPIOs
? Internal ±5.0% 6 or12 MHz main oscillator
? Internal low-speed oscillator at 32 kHz
? Low external component count
? No external crystal or oscillator components
? No external voltage regulator required
■ High-performance CapSense
? Ultra fast scan speed —1 kHz (nominal)
? Reliable finger detection through 5 mm thick acrylic
? Excellent EMI and AC noise immunity
■ Industry best flexibility
? 8 KB flash program storage 50,000 erase and write cycles
? 512-bytes SRAM data storage
? Bootloader for ease of field reprogramming
? Partial flash updates
? Flexible flash protection modes
? Interrupt controller
? In-system serial programming (ISSP)
? Free complete development tool (PSoC Designer?)
? Full-featured, in-circuit emulator and programmer
? Full-speed emulation
? Complex breakpoint structure
? 128 KB trace memory
■ Additional system resources
? Configurable communication speeds
? I2C slave
? SPI master and SPI slave
? Watchdog and sleep timers
? Internal voltage reference
? Integrated supervisory circuit
Features
■ Low power, configurable CapSense
?
? Configurable capacitive sensing elements
? operating voltage
? Operating voltage: 2.4 V to 5.25 V
? Low operating current
? Active 1.5 mA (at 3.0 V, 12 MHz)
? Sleep 2.8 μA (at 3.3 V)
? Supports up to 25 capacitive buttons
? Supports one slider
? Up to 10 cm proximity sensing
? Supports up to 28 general-purpose I/O (GPIO) pins
? Drive LEDs and other outputs
? Configurable LED behavior (fading, strobing)
? LED color mixing (RBG LEDs)
? Pull-up, high Z, open-drain, and CMOS drive modes on all
GPIOs
? Internal ±5.0% 6 or12 MHz main oscillator
? Internal low-speed oscillator at 32 kHz
? Low external component count
? No external crystal or oscillator components
? No external voltage regulator required
■ High-performance CapSense
? Ultra fast scan speed —1 kHz (nominal)
? Reliable finger detection through 5 mm thick acrylic
? Excellent EMI and AC noise immunity
■ Industry best flexibility
? 8 KB flash program storage 50,000 erase and write cycles
? 512-bytes SRAM data storage
? Bootloader for ease of field reprogramming
? Partial flash updates
? Flexible flash protection modes
? Interrupt controller
? In-system serial programming (ISSP)
? Free complete development tool (PSoC Designer?)
? Full-featured, in-circuit emulator and programmer
? Full-speed emulation
? Complex breakpoint structure
? 128 KB trace memory
■ Additional system resources
? Configurable communication speeds
? I2C slave
? SPI master and SPI slave
? Watchdog and sleep timers
? Internal voltage reference
? Integrated supervisory circuit
CY8C20324-12LQXIT MCU Reverse
CY8C20324-12LQXIT MCU Reverse,mcu crack, chip decryption, pcb coping, pcb reverse engineering.
Additional System Resources
System resources, some of which are previously listed, provide
additional capability useful to complete systems. Additional
resources include low voltage detection (LVD) and power on
reset (POR). Brief statements describing the merits of each
system resource follow.
■ The I
2
C slave and SPI master-slave module provides 50, 100,
or 400 kHz communication over two wires. SPI communication
over three or four wires runs at speeds of 46.9 kHz to 3 MHz
(lower for a slower system clock).
■ LVD interrupts signal the application of falling voltage levels,
while the advanced POR circuit eliminates the need for a
system supervisor.
■ An internal 1.8-V reference provides an absolute reference for
capacitive sensing.
■ The 5 V maximum input, 3 V fixed output, low dropout regulator
(LDO) provides regulation for I/Os. A register controlled bypass
mode enables the user to disable the LDO.
Additional System Resources
System resources, some of which are previously listed, provide
additional capability useful to complete systems. Additional
resources include low voltage detection (LVD) and power on
reset (POR). Brief statements describing the merits of each
system resource follow.
■ The I
2
C slave and SPI master-slave module provides 50, 100,
or 400 kHz communication over two wires. SPI communication
over three or four wires runs at speeds of 46.9 kHz to 3 MHz
(lower for a slower system clock).
■ LVD interrupts signal the application of falling voltage levels,
while the advanced POR circuit eliminates the need for a
system supervisor.
■ An internal 1.8-V reference provides an absolute reference for
capacitive sensing.
■ The 5 V maximum input, 3 V fixed output, low dropout regulator
(LDO) provides regulation for I/Os. A register controlled bypass
mode enables the user to disable the LDO.
Thursday, October 18, 2012
CY7C028-15AI MCU Code Reading
CY7C028-15AI MCU Code Reading, Programm Reading, MCU Crack, Chip Decryption.
Features
True dual-ported memory cells which allow
simultaneous access of the same memory location
32K x 16 organization (CY7C027V/027AV
64K x 16 organization (CY7C028V)
32K x 18 organization (CY7C037AV)
64K x 18 organization (CY7C038V)
0.35 micron Complementary metal oxide semiconductor
(CMOS) for optimum speed and power
High speed access: 15, 20, and 25 ns
Low operating power
Active: ICC = 115 mA (typical)
Standby: ISB3
= 10 ?A (typical)
Fully asynchronous operation
Automatic power-down
Expandable data bus to 32/36 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flag for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and Industrial temperature ranges
100-pin Pb-free Thin quad plastic flatpack (TQFP) and 100-pin
TQFP
Features
True dual-ported memory cells which allow
simultaneous access of the same memory location
32K x 16 organization (CY7C027V/027AV
64K x 16 organization (CY7C028V)
32K x 18 organization (CY7C037AV)
64K x 18 organization (CY7C038V)
0.35 micron Complementary metal oxide semiconductor
(CMOS) for optimum speed and power
High speed access: 15, 20, and 25 ns
Low operating power
Active: ICC = 115 mA (typical)
Standby: ISB3
= 10 ?A (typical)
Fully asynchronous operation
Automatic power-down
Expandable data bus to 32/36 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flag for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and Industrial temperature ranges
100-pin Pb-free Thin quad plastic flatpack (TQFP) and 100-pin
TQFP
CY7C037AV-20AXC MCU Code Reading
CY7C037AV-20AXC MCU Code Reading, Programm Reading, MCU Crack, Chip Decryption.
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
CY7C028-15AXC MCU Code Reading
CY7C028-15AXC MCU Code Reading, Programm Reading, MCU Crack, Chip Decryption.
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
CY7C028-15AXI MCU Code Reading
CY7C028-15AXI MCU Code Reading, Programm Reading, MCU Crack, Chip Decryption.
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
CY7C027-20AXCT MCU Code Reading
CY7C027-20AXCT MCU Code Reading, Programm Reading, MCU Crack, Chip Decryption.
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
CY7C027-20AXCT MCU Code Reading
CY7C027-20AXCT MCU Code Reading, Programm Reading, MCU Crack, Chip Decryption.
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
CY7C027-20AXIT MCU Code Reading
CY7C027-20AXIT MCU Code Reading, Programm Reading, MCU Crack, Chip Decryption.
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
Thursday, October 11, 2012
M16C/28 series Renesas MCU reverse
M16C/28 series Renesas MCU reverse, chip decryption, code
extraction. 16-bit Multifunction Timer (Timer A and B, incl. 3-phase
inverter motor control function): 8 channels
Input Capture/Output Compare Timer (Timer S)
Base Timer: 16-bit x 1 channel
I/O: 8 channels
UART/Clock Synchronous Serial Interface: 3 channels
Clock Synchronous Serial Interface: 2 channels*
Multi-Master I2C-bus: 1 channel
10-bit A/D Converter: 24 channels (Normal-ver.)*, 27 channels
(T-ver./V-ver.)*
DMAC: 2 channels
CRC Calculation Circuit (Except for Normal-ver.)
Watchdog Timer
Clock Generation Circuits: Main Clock Generation Circuit, Sub
Clock Generation Circuit, On-chip Oscillator, PLL Synthesizer
Oscillation Stop Detection Function
Voltage Detection Circuit (Except for T-ver. and V-ver.)
extraction. 16-bit Multifunction Timer (Timer A and B, incl. 3-phase
inverter motor control function): 8 channels
Input Capture/Output Compare Timer (Timer S)
Base Timer: 16-bit x 1 channel
I/O: 8 channels
UART/Clock Synchronous Serial Interface: 3 channels
Clock Synchronous Serial Interface: 2 channels*
Multi-Master I2C-bus: 1 channel
10-bit A/D Converter: 24 channels (Normal-ver.)*, 27 channels
(T-ver./V-ver.)*
DMAC: 2 channels
CRC Calculation Circuit (Except for Normal-ver.)
Watchdog Timer
Clock Generation Circuits: Main Clock Generation Circuit, Sub
Clock Generation Circuit, On-chip Oscillator, PLL Synthesizer
Oscillation Stop Detection Function
Voltage Detection Circuit (Except for T-ver. and V-ver.)
inverter motor control function
inverter motor control function): 8 channels
Input Capture/Output Compare Timer (Timer S)
Base Timer: 16-bit x 1 channel
I/O: 8 channels
UART/Clock Synchronous Serial Interface: 3 channels
Clock Synchronous Serial Interface: 2 channels*
Multi-Master I2C-bus: 1 channel
10-bit A/D Converter: 24 channels (Normal-ver.)*, 27 channels
(T-ver./V-ver.)*
DMAC: 2 channels
CRC Calculation Circuit (Except for Normal-ver.)
Watchdog Timer
Clock Generation Circuits: Main Clock Generation Circuit, Sub
Clock Generation Circuit, On-chip Oscillator, PLL Synthesizer
Oscillation Stop Detection Function
Voltage Detection Circuit (Except for T-ver. and V-ver.)
I/O Ports: 71*
External Interrupt Pins: 11
Data Flash: 2KB × 2 blocks (Flash Memory Version only)
Input Capture/Output Compare Timer (Timer S)
Base Timer: 16-bit x 1 channel
I/O: 8 channels
UART/Clock Synchronous Serial Interface: 3 channels
Clock Synchronous Serial Interface: 2 channels*
Multi-Master I2C-bus: 1 channel
10-bit A/D Converter: 24 channels (Normal-ver.)*, 27 channels
(T-ver./V-ver.)*
DMAC: 2 channels
CRC Calculation Circuit (Except for Normal-ver.)
Watchdog Timer
Clock Generation Circuits: Main Clock Generation Circuit, Sub
Clock Generation Circuit, On-chip Oscillator, PLL Synthesizer
Oscillation Stop Detection Function
Voltage Detection Circuit (Except for T-ver. and V-ver.)
I/O Ports: 71*
External Interrupt Pins: 11
Data Flash: 2KB × 2 blocks (Flash Memory Version only)
M16C/28 series Renesas MCU reverse
M16C/28 series Renesas MCU reverse, chip decryption, code
extraction.
Key Features:
16-bit Multifunction Timer (Timer A and B, incl. 3-phase
inverter motor control function): 8 channels
Input Capture/Output Compare Timer (Timer S)
Base Timer: 16-bit x 1 channel
I/O: 8 channels
UART/Clock Synchronous Serial Interface: 3 channels
Clock Synchronous Serial Interface: 2 channels*
Multi-Master I2C-bus: 1 channel
10-bit A/D Converter: 24 channels (Normal-ver.)*, 27 channels
(T-ver./V-ver.)*
DMAC: 2 channels
CRC Calculation Circuit (Except for Normal-ver.)
Watchdog Timer
Clock Generation Circuits: Main Clock Generation Circuit, Sub
Clock Generation Circuit, On-chip Oscillator, PLL Synthesizer
Oscillation Stop Detection Function
Voltage Detection Circuit (Except for T-ver. and V-ver.)
I/O Ports: 71*
External Interrupt Pins: 11
Data Flash: 2KB × 2 blocks (Flash Memory Version only)
*: Spec of 85-pin version and 80-pin version.
extraction.
Key Features:
16-bit Multifunction Timer (Timer A and B, incl. 3-phase
inverter motor control function): 8 channels
Input Capture/Output Compare Timer (Timer S)
Base Timer: 16-bit x 1 channel
I/O: 8 channels
UART/Clock Synchronous Serial Interface: 3 channels
Clock Synchronous Serial Interface: 2 channels*
Multi-Master I2C-bus: 1 channel
10-bit A/D Converter: 24 channels (Normal-ver.)*, 27 channels
(T-ver./V-ver.)*
DMAC: 2 channels
CRC Calculation Circuit (Except for Normal-ver.)
Watchdog Timer
Clock Generation Circuits: Main Clock Generation Circuit, Sub
Clock Generation Circuit, On-chip Oscillator, PLL Synthesizer
Oscillation Stop Detection Function
Voltage Detection Circuit (Except for T-ver. and V-ver.)
I/O Ports: 71*
External Interrupt Pins: 11
Data Flash: 2KB × 2 blocks (Flash Memory Version only)
*: Spec of 85-pin version and 80-pin version.
M30260F3AGP
M30260F3AGP M30260F6AGP M30260F8AGP M30260M3A-XXXGP M30260M6A-
XXXGP M30260M8A-XXXGP M30263F3AFP M30263F6AFP M30263F8AFP
M30263M3A-XXXFP M30263M6A-XXXFP M30263M8A-XXXFP M30260F8BGP
M30263F8BFP M30260F3TGP M30260F6TGP M30260F8TGP
Key Features
Key Features:
16-bit Multifunction Timer (Timer A and B, incl. 3-phase
inverter motorcontrol function): 8 channels
UART/Clock Synchronous Serial Interface: 3 channels*
10-bit A/D Converter: 12 channels*
DMAC: 2 channels
CRC Calculation Circuit
Watchdog Timer
Clock Generation Circuits: Main Clock Generation Circuit, Sub
ClockGeneration Circuit, On-chip Oscillator, PLL Synthesizer
Oscillation Stop Detection Function
Voltage Detection Circuit (M16C/26A and M16C/26B only)
I/O Ports: 39*
External Interrupt Pins: 11
Data Flash: 2KB × 2 blocks (Flash Memory Version only)
*: Spec of 48-pin version.
16-bit Multifunction Timer (Timer A and B, incl. 3-phase
inverter motorcontrol function): 8 channels
UART/Clock Synchronous Serial Interface: 3 channels*
10-bit A/D Converter: 12 channels*
DMAC: 2 channels
CRC Calculation Circuit
Watchdog Timer
Clock Generation Circuits: Main Clock Generation Circuit, Sub
ClockGeneration Circuit, On-chip Oscillator, PLL Synthesizer
Oscillation Stop Detection Function
Voltage Detection Circuit (M16C/26A and M16C/26B only)
I/O Ports: 39*
External Interrupt Pins: 11
Data Flash: 2KB × 2 blocks (Flash Memory Version only)
*: Spec of 48-pin version.
M16C/26A series Renesas MCU reverse
M16C/26A series Renesas MCU reverse, chip decryption, code
extraction.
Key Features:
16-bit Multifunction Timer (Timer A and B, incl. 3-phase
inverter motorcontrol function): 8 channels
UART/Clock Synchronous Serial Interface: 3 channels*
10-bit A/D Converter: 12 channels*
DMAC: 2 channels
CRC Calculation Circuit
Watchdog Timer
Clock Generation Circuits: Main Clock Generation Circuit, Sub
ClockGeneration Circuit, On-chip Oscillator, PLL Synthesizer
Oscillation Stop Detection Function
Voltage Detection Circuit (M16C/26A and M16C/26B only)
I/O Ports: 39*
External Interrupt Pins: 11
Data Flash: 2KB × 2 blocks (Flash Memory Version only)
*: Spec of 48-pin version.
M30260F3AGP M30260F6AGP M30260F8AGP M30260M3A-XXXGP M30260M6A-
XXXGP M30260M8A-XXXGP M30263F3AFP M30263F6AFP M30263F8AFP
M30263M3A-XXXFP M30263M6A-XXXFP M30263M8A-XXXFP M30260F8BGP
M30263F8BFP M30260F3TGP M30260F6TGP M30260F8TGP
extraction.
Key Features:
16-bit Multifunction Timer (Timer A and B, incl. 3-phase
inverter motorcontrol function): 8 channels
UART/Clock Synchronous Serial Interface: 3 channels*
10-bit A/D Converter: 12 channels*
DMAC: 2 channels
CRC Calculation Circuit
Watchdog Timer
Clock Generation Circuits: Main Clock Generation Circuit, Sub
ClockGeneration Circuit, On-chip Oscillator, PLL Synthesizer
Oscillation Stop Detection Function
Voltage Detection Circuit (M16C/26A and M16C/26B only)
I/O Ports: 39*
External Interrupt Pins: 11
Data Flash: 2KB × 2 blocks (Flash Memory Version only)
*: Spec of 48-pin version.
M30260F3AGP M30260F6AGP M30260F8AGP M30260M3A-XXXGP M30260M6A-
XXXGP M30260M8A-XXXGP M30263F3AFP M30263F6AFP M30263F8AFP
M30263M3A-XXXFP M30263M6A-XXXFP M30263M8A-XXXFP M30260F8BGP
M30263F8BFP M30260F3TGP M30260F6TGP M30260F8TGP
M16C/24 (M30245)series Renesas MCU reverse
M16C/24 (M30245)series Renesas MCU reverse, chip decryption,
code extraction.
Product Overview:
The M30245 (M16C/24 Group) consists of 16-bit single-chip MCUs
compliantwith the Full-Speed USB2.0. Embedding a powerful M16C
CPU core, the M16C familyhas rich peripheral functions and
handles high-speed processing withsophisticated instructions in
addition to its various USB control functionssuch as the USB
pull-up power source circuit, USB pull-up power source
circuit,USB clock generator. The maximum 9 endpoints are
equipped with FIFO to handleall USB transfer types.
code extraction.
Product Overview:
The M30245 (M16C/24 Group) consists of 16-bit single-chip MCUs
compliantwith the Full-Speed USB2.0. Embedding a powerful M16C
CPU core, the M16C familyhas rich peripheral functions and
handles high-speed processing withsophisticated instructions in
addition to its various USB control functionssuch as the USB
pull-up power source circuit, USB pull-up power source
circuit,USB clock generator. The maximum 9 endpoints are
equipped with FIFO to handleall USB transfer types.
audio applications
With the M30245, the addition of multi-bit serial interface
realizes audiointerface function, the generator CRC calculating
function enhances memory cardinterface function and other steps
are taken for audio applications making thissystem simple to
configure for use in memory card application fields. USBfunction
is also improved with the mounting of large-capacity
FIFO,programmable FIFO volume capacity settings and strengthened
continuous transferfunction. Besides this, an onboard rewritable
flash memory version is alsoavailable, while highly demanded
external bus access is available as well. Forevaluation tools of
this group, please click left navigation "Software andTools".
Key Applications:
USB peripheral equipment
Telephone
Audio System
PC Peripheral
Communication Apparatus
Pocket Apparatus
Scanner
Digital Camera
Memory Card Reader, others
realizes audiointerface function, the generator CRC calculating
function enhances memory cardinterface function and other steps
are taken for audio applications making thissystem simple to
configure for use in memory card application fields. USBfunction
is also improved with the mounting of large-capacity
FIFO,programmable FIFO volume capacity settings and strengthened
continuous transferfunction. Besides this, an onboard rewritable
flash memory version is alsoavailable, while highly demanded
external bus access is available as well. Forevaluation tools of
this group, please click left navigation "Software andTools".
Key Applications:
USB peripheral equipment
Telephone
Audio System
PC Peripheral
Communication Apparatus
Pocket Apparatus
Scanner
Digital Camera
Memory Card Reader, others
Subscribe to:
Posts (Atom)